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Memory Wafer：25 pcs / Lot >>
2 Device
DDR4 1G*8
DDR4 512M*16
DDR5/ HBM V2 Coming soon
Memory 测试机：在测试厂生产
投片月产能 2000 片晶圆以上
RD team 协助开发测试程式，测试通过才能进行下一制程
外包 IC 封测厂：多焦点低功率雷射隐形切割机保证切割品质
封装厂 DDR4 标准颗粒：先进封装设备
骏吉科技成品出货
| Features | DDR4 | DDR5 | DDR5 Advantages |
|---|---|---|---|
| Speed | 1.6 to 3.2 GT/s 0.8 to 1.6 GHz clock | 4.8 to 8.4 GT/s 1.6 to 4.2 GHz clock | Higher bandwidth |
| IO Voltage | 1.2V | 1.1V | Lower power |
| Power Management | On motherboard | On DIMM PMIC | Better power efficiency Better scalability |
| Channel Architecture | 72-bit data channel (64 data + 8 ECC) 1 channel per DIMM | 40-bit data channel (32 data + 8 ECC) 2 channels per DIMM | Higher memory efficiency Lower latency |
| Burst Length | BC4, BL8 | BC8, BL16 | Higher memory efficiency |
| Max. Die Density | 16Gb | 64Gb | Higher capacity DIMMS |
| More Intelligence | SPD (IZC) | SPD Hub & Temperature Sensors (I"C) | Enhanced system management Greater telemetry for thermal management |