Inmax Holding is engaged across the entire semiconductor supply chain—from front-end to back-end processes. Its product portfolio includes electron beam (e-beam) equipment, lithography systems, wafer laser dicing machines, advanced materials and components, as well as customized turnkey solutions, demonstrating strong capabilities in system integration and applied technology.

Laser Dicer

Mdel Name			IM LG3001	IM LG3002	IM LS3001	IM LS3002	IM LS2002
Processing Method		Units	SI Grooving	SI Grooving	SI Stealth	Glass Stealth	SIC Stealth
Laser Source	Wave Length	nm	532mm	532mm	1135mm	532mm	1064mm
	Power	w	60W	60W	8W	20W	18W
		PS	PICO	PICO	PICO	PICO	PICO
	Shaping Method		SLM	SLM/DOE	SLM	SLM	SLM
Wafer Size		inch	6", 8", 12"	6", 8", 12"	6", 8", 12"	6", 8", 12"	6", 8"
X-axis	Processing range	mm	500	500	500	500	300
	Moving speed	mm/s	50~1000	50~1000	50~1000	50~1000	50~1000
	Linearity	um	±0.5	±0.5	±0.5	±0.5	±1
	Repeatability Accuracy	um	±0.2	±0.2	±0.2	±0.2	±0.5
Y-axis	Processing range	mm	450	450	450	450	300
	Linearity	um	±1	±1	±0.5	±0.5	±1
	Repeatability Accuracy	um	±0.5	±0.5	±0.2	±0.2	±0.5
Optical Axis	Moving resolution	mm	0.00005	0.00005	0.00005	0.00005	0.00005
Optical Axis	Repeatability accuracy	mm	0.001	0.001	0.001	0.001	0.001
θ-axis (Chuck table)		deg	120	120	120	120	120
Power consumption		kW	11	11	6	5.5	6
Compressed air		kg	6.5	6.5	6.5	6.5	6.5
Air consumption		L/mins	3000	3000	2000	2000	2000
Weight		T	4.4~4.6	4.4~4.6	3.2~3.6	3.2~3.6	3.1~3.5