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| Chip core |
|---|
| Processor compute cores |
| Logical memory core |
| Transmission interface core |
| Power management core |
| EDA/IP Design |
| Chip design |
|---|
| Logical design |
| Circuit design |
| Graphic design |
| Prototyping |
| Tape-out |
| Bottom extension |
|---|
| Czochralski process |
| Die saw / Grinder |
| Die saw / Grinder |
| Visual inspection |
| CVD |
| Polishing inspection |
| Packaged and shipped |
| Wafer fabrication |
|---|
| Masking / Lithography |
| Etching / Inspection |
| PVD/Ionization Injection/Film |
| Cutting / grinding/polishing |
| Wafer parameter testing |
| Wafer parameter testing |
| Packaged and shipped |
| Advanced packaging |
|---|
| Lithography / engraving |
| Plating / Bumping |
| Grinding / slurping |
| Bonding |
| Molding / cutting |
| Packaged and shipped |
| Test |
|---|
| Wafer test |
| Finished product test |
| Electrical test |
| Reliability |
| Visual inspection |
| Packaged and shipped |
UF3000
UF200 Series
P12XL Series
Disco Dicer
PCB
Driver
Component
Chiller
Docking Kit
G2 Upgrade
E6C Upgrade
PCB
Chuck
Servo Driver
Temp. Meter
Relocation
Training
Corrective maintenance